DDR4 SODIMM

Exascend’s DDR4 SODIMMs provide unmatched performance, reaching speeds up to 3200 MT/s for ADAS, telecom, networking, computing, and embedded systems. With capacities from 8GB to 32GB, these JEDEC-standard modules are purpose-built for industrial and embedded applications. Whether Wide-Temperature or Standard-Temperature version, they ensure reliability, compatibility, and durability in harsh operating conditions.

Inquiry

Note: Promotional label not included with product. Actual product labeling may differ from marketing images.

Original wide-temp / Quality ICs

From major manufacturers

-40°C to 85°C
0°C to 70°C

Op. temp

Up to

0 GB

Capacity

0 MT/s

Data rate

1.2V

JEDEC standard

Reliable DDR4 SODIMM Designed for Industrial and Embedded Applications

Note: Promotional label not included with product. Actual product labeling may differ from marketing images.

Wide-Temp Edition

  • Original wide-temperature ICs from major memory manufacturers ensure compatibility, performance and reliability.
  • Rigorous testing and adherence to JEDEC standards ensure high-quality assurance.
  • 30μ” thick gold plated interfaces on the PCB significantly increase the plug/unplug service life.
  • Anti-sulfur protection guards against corrosion over time.
  • Combined with conformal coating and underfill options, this rigid plating durability enables reliable performance despite vibration, extreme temperatures, and humidity.

Product Specs and Datasheet →

Standard-Temp Edition

  • Quality ICs from major memory manufacturers ensure compatibility, performance and reliability.
  • Rigorous testing and adherence to JEDEC standards ensure high-quality assurance.
  • Enhanced with conformal coating and underfill options for increased durability, ensuring reliable performance despite vibration and humidity.

Product Specs and Datasheet →

Note: Promotional label not included with product. Actual product labeling may differ from marketing images.

Where to buy

Featured Storage Technologies

未命名-1

Conformal Coating

Exascend employs conformal coating technology to apply a protective acrylic layer over DRAM modules, safeguarding against contaminants and moisture that could impact performance. This coating shields PCB and components from acids, particles, corrosion and extreme temperatures.

Underfill

Exascend utilizes underfill technology with epoxy bonding, securing integrated circuits to the PCB and minimizing BGA-related malfunctions. This creates a resilient connection, reducing susceptibility to factors like friction and shocks, while also inhibiting tin whisker formation.

1

Wide Temperature Range of -40°C to 85°C

Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.

Recommended Applications

Product Information

Scroll to Top

Exascend Newsletter

Subscribe to our newsletter to receive updates about products, services, events and resources you may find of interest.

Product Inquiry

Please ensure the email address you provide is accurate and valid. This is crucial for us to effectively communicate with you.

Download DDR4 SODIMM
wide-temp datasheet

Download DDR4 SODIMM
standard-temp datasheet

capacitor-whitepaper-preview
capacitor-whitepaper-preview-2

Download whitepaper